Intel
Intel S4189 XEON GOLD 5317 TRAY 12x3 150W
12 cores, 3 GHz base frequency, 6 TB RAM, LGA 4189, 150 W TDP
The Intel Xeon Gold 5317 processor offers high performance for server applications with 12 cores and a base frequency of 3 GHz. It supports up to 6 TB of RAM and is ideal for cloud computing environments.
CHF2,188.95
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Description
The Intel Xeon Gold 5317 is a powerful processor specifically designed for servers and workstations. With an advanced 10nm lithography and 12 cores, it offers an impressive base frequency of 3 GHz, which can be boosted up to 3.6 GHz. It supports up to 6 TB of DDR4 SDRAM and is equipped with a variety of instruction sets, including AVX-512, to efficiently handle complex calculations. The high scalability and support for Intel SGX make it the ideal choice for demanding applications in the cloud.
Specifications
| General | |
|---|---|
| Processor Manufacturer | Intel |
| Processor | 5317 |
| Processor Generation | Scalable Intel® Xeon® 3rd Generation |
| Number of Processor Cores | 12 |
| Processor Threads | 24 |
| Processor Socket | LGA 4189 |
| Processor Lithography | 10 nm |
| Processor Boost Frequency | 3.6 GHz |
| Thermal Design Power (TDP) | 150 W |
| Processor Codename | Ice Lake |
| ARK Processor ID | 215272 |
| Memory | |
| Maximum Internal Memory Supported by Processor | 6 TB |
| Memory Types Supported by Processor | DDR4-SDRAM |
| Memory Channels | Octa-channel |
| Feature | ECC |
| Features | |
| Market Segment | Server |
| Maximum Number of PCI Express Lanes | 64 |
| PCI Express Slot Version | 4.0 |
| Supported Instruction Sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
| Scalability | 2S |
| Feature | Embedded Options Available |
| Operating Conditions | |
| Tcase | 84 °C |
| Technical Details | |
| Target Market | Cloud Computing |
| Launch Date | Q2'21 |
| Status | Launched |
| Supported Memory | DDR4-SDRAM |
| Memory Speed (max.) | 2933 MHz |
| Number of UPI Links | 3 |
| Maintenance Status | Baseline Servicing |
| Logistics Data | |
| Harmonized System Number (HS) | 85423119 |
| Weight and Dimensions | |
| Processor Package Size | 77.5 x 56.5 mm |